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Adaptsys will present the Re-flex II On Demand Carrier Tape Forming System live in action on Booth 1540 at SEMICON West in San Francisco on July 12-14, 2022
Visit Adaptsys on Booth #N1014 at SEMICON SEA in Penang, Malaysia on June 21-23, 2022
Visit Adaptsys on stand 4-360 at SMT Connect in Nuremberg, Germany on 10-12 May 2022
Visit Adaptsys at Stand G90 at SOUTHERN Manufacturing & Electronics in Farnborough on 8-10 February 2022
Adaptsys invites you to IPC APEX EXPO 2022 in San Diego on January 25-27, 2022 (Stand 2241) to see the latest version of Re-flex II with deep pocket forming technology.
Adaptsys is happy to be back at Productronica (Hall 1, Stand 353) on 16-19 November 2021 in Munich, Germany.
Adaptsys presents the Re-flex II On-Demand Carrier Tape Forming System at Motek 2021 (Hall 5, Stand 5403) on 5-8 October in Stuttgart, Germany.
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