Automated socket modules are offered for a wide variety of package types including CSP, TSOP, DIP and MLF.
The 4900 supports high-speed, high-volume device programming for MCUs, Serial Flash, NAND, NOR and eMMC HS400 modes. True universal programming sites, BPM Vision™ 3D inspection, Hybrid Laser Marking System options, and software API support the most demanding production programming.