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EXHIBITION - What's NEW In Electronics

Friday, 07 September 2018 11:59

WNIE live 960x205 2

Adaptsys invites you to What's New in Electronics at the NEC in Birmingham on 25-26 September 2018 (Stand E50) to see the latest version of Re-flex II with deep pocket forming technology.

At this year's What's New In Electronics, Adaptsys will be showing the latest version of the Re-flex II Carrier Tape Forming System, now with a re-designed tooling module capable of forming pockets up to 30mm in depth on tape widths ranging from 12mm to 88mm. The Re-flex will be connected directly to the V-TEK TM-50OEM taping machine to demonstrate the System's unique functionality of outputting directly into the device placement process (On-demand). By extending the Re-flex II capacity to form deeper and wider pockets, in addition to standard electronic devices, the system can now form tape suitable for much larger, and often complex, devices including connectors and metal stamped parts. Further practical features that set the Re-flex II apart from other tape forming systems on the market include the streamlined tooling changeover, which means that moving between different pocket types can be achieved within 3 minutes. 

Alongside the OEM version of the TM-50 manual taping system from V-TEK International, Adaptsys will also be showcasing a range of device programmers on its stand, including the latest 9TH GEN manual programming solutions from BPM Microsystems and the newly released FlashRunner LAN2.0 NXG In-System Programmer from SMH Technologies. 

Click for free entry to the show

Adaptsys will be exhibiting at What's New in Electronics at the NEC in Birmingham on 25-26 September 2018. Please click on the banner above for free entry to the show. We look forward to welcoming you to our stand (E50).

 

 

 

 

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