Programmateurs   •   Solution de mise en bande   •   Bande alvéolée

Adaptsys au salon IPC APEX EXPO 2023 à San Diego

jeudi, 19 janvier 2023 13:39

Adaptsys vous invite au salon IPC APEX EXPO à San Diego du 24 au 26 janvier, 2023 (stand 1100) pour découvrir notre Re-flex II système de thermoformage.


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With innovation not seen in the Carrier Tape industry in decades, the Re-flex II Carrier Tape Forming System sets itself apart from all other carrier tape forming systems by providing a platform for in-line ‘real-time’ carrier tape production. Unlike other tape forming systems that rely on the use of cardboard reels as the output method, the Re-flex II forms carrier tape on demand, directly into the tape and reel process.

Offering significant advantages over the traditional method of Carrier Tape management, the Re-flex II will:
·  Save you money
·  Eliminate lengthy material lead times
·  Improve process
·  Simplify inventory
·  Reduce waste

Handling material widths from 8mm thru 88mm and with the capacity to form an almost infinite variety of pockets (including depths up to 30mm), the Re-flex II has the flexibility as the chosen solution for many market sectors including, but not limited to - Semi-conductors, Connectors, Metal-stamping…and with a visual inspection on every pocket coming as standard, QA is guaranteed.

 Click here to register

Further details can be found online at

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