At this year's IPC APEX EXPO, Adaptsys will be showing the latest version of the Re-flex II Carrier Tape Forming System, now with a re-designed tooling module capable of forming pockets up to 30mm in depth on tape widths ranging from 12mm to 88mm. The Re-flex will be connected directly to the V-TEK TM-50 taping machine to demonstrate the System's unique functionality of outputting directly into the device placement process (On-demand). By extending the Re-flex II capacity to form deeper and wider pockets, in addition to standard electronic devices, the system can now form tape suitable for much larger, and often complex, devices including connectors and metal stamped parts. Further practical features that set the Re-flex II apart from other tape forming systems on the market include the streamlined tooling changeover, which means that moving between different pocket types can be achieved within 3 minutes.
Having recently introduced a new-look interface to our Re-flex II Carrier Tape Forming System, the latest software modification enhances the overall usability of the Re-flex II and provides the end user with an intuitive and effective tool to manufacture both standard and custom pockets.
Further details can be found online at www.reflex-odt.com
Also at this year's IPC APEX EXPO...
IS-300 Vision Inspection on the TM-50 manual taping system from V-TEK International.
Traceability and quality validation are now possible on all TM-50 taping machines with the IS-300 inspection system from Adaptsys. Available on new systems or as a simple field upgrade option, the IS-300 provides part inspection checks for orientation, presence, mark and colour. In addition to the standard IS-300 assembly, an optional second sensor can be included to check cover tape bond and ensure integrity of both the outer and inner seal.
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Adaptsys will be exhibiting at IPC APEX EXPO 2019 in San Diego on January 29-31, 2019. Please click on the button above to register for free entry. We look forward to welcoming you to our stand (Booth 1521).