Device Package Dimensions
The CyberOptics laser alignment camera is the heart of the vision centering system and you will need to specify the dimensions of your device. A library of package types comes with the BPWin software. The settings for a package can be edited. The dimensions of the device are stored under a package type name for future jobs.
Using Auto Measure
If the interlock(s) are opened during the auto measure process, the process will be aborted to avoid discrepancies when measuring the component. The following illustrates using the auto measure utility on a BP-4000 series Autohandler to measure a TSOP48 package.
- Open the Select Location to Teach dialog and select the package.
- Click the Teach button to display the package type dialog.
- Click on the Auto Measure button to start the utility. You will be presented with the Adjust Nozzle Position dialog to help assist in learning the location of the device. Use the arrows to position the nozzle as close to the center of the device then click the OK button to auto-learn the location of the device.
- After the location has been taught, you will be presented with a Package Auto Measure Utility dialog. The stages after teaching the device location can be lengthy depending on the thickness of the device. An Abort button is provided to allow you to terminate the entire process and place the device back in its original orientation.
- After the process is completed the package settings will have been updated. You will see a completion notification dialog.
- Click the OK button to complete the process and review the changes in the package type dialog put in by the utility.
Note: If the longest length is within 1% of the narrowest length, then the utility will consider the package to be square and will set both lengths equal to the narrowest length.
More information about this feature can be found in the Automated Package Measure Utility FAQ.
Manually Editing
The contents in the Select Location to Teach dialog are imported from what was entered in the Autohandler Workflow Settings dialog.
Select the package type (ex: TSOP32) you specified on the Autohandler Workflow Settings dialog and click on the Teach button. The package type dialog appears on the screen.
- Populate the following the fields in the Device Package Dimensions section according to the manufacturer's data or specification sheets:
- Device thickness, including any leads - enter the thickness of the device with the inclusion of any leads. Cyberoptic laser align sensor requires this information to align the device properly.
- Device narrowest length, including any leads - enter the narrowest length of the device with the inclusion of any leads.
- Device longest length, including any leads - enter the longest length of the device with the inclusion of any leads.
- Equal Lengths - select the checkbox to designate if the narrowest and longest lengths should be equal.
Pin Numbering Style
Choose how pin 1 is determined on the package. The style selected here will show how pin 1 is oriented on the package in the Adjust Nozzle Position dialog when an input or output location is selected for teaching.
SOIC, TSOP, µBGA - Select this option to represent an
- SOIC, uBGA, TSOP - or package style. This type of package style will display the pin one location at a corner of the package in the Adjust Nozzle Position dialog and it will also display the "'reverse" pin one location in the same dialog.
- PLCC (centered pin 1) - Select this option to represent a PLCC package style. This type of package style will have pin one located at a center of the package.
- QFP (corner pin 1) - Select this option to represent a QFP package style. This type of package style will have pin one located at a corner of the package.
- DIP - Select this option to represent a DIP package style. This type of package style will have pin one located at a corner of the package. If this package's diagonal maxima exceeds 1055 mils (2.6797 mm) and vision centering is enabled then a warning message to disable vision centering, as illustrated in Figure A, will be presented when the OK button is selected.
VSP Nozzle Obstruction Detection
Note: This section is available only on 4000-series APSs when the package dimensions meet the criteria for Very Small Package (VSP).
By measuring the change in vacuum to detect an obstruction the PnP can know when to begin raising the nozzle with the device attached when performing a pick operation. On the smallest devices pick errors may occur because this change is smaller than with larger devices. To account for this you can adjust the value used to determine when the nozzle has been obstructed. You should only adjust this value if you notice an unusual number of pick errors with VSP devices during a job session.
To adjust this value, follow these steps:
- Ensure the nozzle is currently unobstructed with no device attached.
- Click the "Vacuum" button. This will turn on the vacuum and enable the adjustment slider and the obstruction indicator.
- Place a device on the nozzle. Obstruction detection is indicated below the slider.
- Using the slider, adjust the value as appropriate. Decreasing the adjustment percentage will cause the system to use a value that's closer to the unobstructed value while increasing the percentage will use a value that is further.
Note: The variation in vacuum pressure may cause the system to read values that never change the behavior of the obstruction indicator. The indicator is present only as a guideline and ultimately the adjustment value should be determined based on the performance of pick operations during a job session.
The adjustment percentage value is saved along with all other package parameters for future jobs.