Adaptsys invites you to SMT Hybrid Packaging in Nuremberg on 5-7 June 2018 (Stand 4A-132) to see the latest version of Re-flex II, with deep pocket forming technology.

Adaptsys invites you to Enova Toulouse on 30-31 May 2018 (Stand C38) to see the latest version of Re-flex II, with deep pocket forming technology.

Interview with James Holava, BPM Microsystems, at Productronica 2017 in Munich

 

 

 

 

 

 

 

Adaptsys introduce Deep Pocket Carrier Tape Forming with Re-flex II at Productronica, Munich, 14-17 November 2017 (Hall A1, Booth 353).

 

Adaptsys are pleased to announce that we shall be exhibiting at the forthcoming SMTA International exhibition at the Donald E. Stephens Convention Center (Rosemont, IL) on 19-20 September 2017.